DocumentCode :
1873199
Title :
Design and fabrication of field emission-based pressure microsensors
Author :
Badi, N. ; He, K. ; Nair, A. ; Bensaoula, A.
Author_Institution :
Dept. of Phys., Houston Univ., TX, USA
fYear :
2004
fDate :
11-16 July 2004
Firstpage :
24
Lastpage :
25
Abstract :
The development of functional field emission based pressure microsensors is reported. The fabrication and development of both electrical and mechanical parts of the pressure sensor device are investigated; these are the cold cathode emitters and the sensing membranes, respectively. In order to avoid expensive process runs and optimize the design to meet the sensor requirements, simulation work was performed using commercially available FEMLAB package software. Realistic field emission characteristics from sulfur doped boron nitride (S-BN) cold cathode were used to model the current density distribution in the deflected diaphragm. The total current output was achieved by integrating the current density over the entire area of the membrane as a function of the external pressure.
Keywords :
boron compounds; cathodes; current density; field emission; microsensors; pressure sensors; silicon; tantalum; titanium; titanium compounds; BN:S; FEMLAB package software; Si; Ta; Ti; TiN; cold cathode emitters; current density distribution modelling; deflected diaphragm; electrical parts; field emission characteristics; field emission-based pressure microsensors; mechanical parts; microsensor design; microsensor fabrication; sensing membranes; sensor requirements; sulfur doped boron nitride cold cathode; total current output; Biomembranes; Cathodes; Current density; Design optimization; Fabrication; Mechanical sensors; Microsensors; Packaging; Sensor phenomena and characterization; Software packages;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Nanoelectronics Conference, 2004. IVNC 2004. Technical Digest of the 17th International
Print_ISBN :
0-7803-8397-4
Type :
conf
DOI :
10.1109/IVNC.2004.1354880
Filename :
1354880
Link To Document :
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