Title :
Microvia technology in MCM-D/L-need, challenge, and response
Author :
Li, Weipmg ; Tummala, Rao
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented
Keywords :
integrated circuit interconnections; integrated circuit packaging; multichip modules; wiring; Georgia Tech; IC interconnections; MCM-D/L; Packaging Research Center; high-density wiring substrates; microvia technology; Calendars; Costs; Drives; Electronics industry; Nonhomogeneous media; Packaging; Partial response channels; Substrates; Transistors; Wiring;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664434
