• DocumentCode
    1874313
  • Title

    Use of microstrip patch antennas in grain and pulverized materials permittivity measurement

  • Author

    El Sabbagh, M.A. ; Ramahi, O.M. ; Trabelsi, S. ; Nelson, S.O. ; Khan, L.

  • Author_Institution
    Richard B. Russell Agric. Res. Center, USDA-ARS, Athens, GA, USA
  • Volume
    4
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    42
  • Abstract
    In this paper, we report on a free-space microwave system developed for the measurement of the relative complex permittivity of granular materials (wheat, soybeans and corn) and of pulverized materials (coal). The system consists of a transmitting antenna and a receiving antenna separated by a space filled by the sample to be characterized and a network analyzer for transmission measurement. The receiving antenna is mounted on a movable plate, which gives the flexibility of having different sample thicknesses. The system is considered a two-port device. The testing procedure developed is nondestructive and easy for implementation. At a fixed moisture level, the dielectric constant and loss factor of the test materials are determined and compared with other published data.
  • Keywords
    S-parameters; agricultural products; coal; granular materials; microstrip antennas; microwave measurement; moisture measurement; permittivity measurement; pulverised fuels; coal; complex permittivity measurement; corn; dielectric loss factor; free-space microwave system; granular materials; microstrip patch antennas; microwave network analyzer; microwave sensor; moisture content measurement; pulverized materials; receiving antenna; scattering parameters; soybeans; transmitting antenna; two-port device; wheat; Antenna measurements; Dielectric measurements; Microstrip antennas; Microwave measurements; Moisture; Nondestructive testing; Patch antennas; Permittivity measurement; Receiving antennas; Transmitting antennas;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1221393
  • Filename
    1221393