• DocumentCode
    1874340
  • Title

    A high-q all-fused silica solid-stem wineglass hemispherical resonator formed using micro blow torching and welding

  • Author

    Jae Yoong Cho ; Najafi, Khalil

  • Author_Institution
    Center for Wireless Integrated MicroSensing & Syst. (WIMS2), Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2015
  • fDate
    18-22 Jan. 2015
  • Firstpage
    821
  • Lastpage
    824
  • Abstract
    We report a new fabrication technology for making fused silica (FS) wineglass resonators with arbitrarily sized FS solid stems through a simultaneous process of micro blow-torching and microwelding. The process allows the welding of multiple FS structures at controlled locations during blow torching. We demonstrate a new micro FS wineglass resonator with high quality factor (Q) and long ring down time (τ). The resonator is formed by blow torching and flowing a thin FS substrate using vacuum to form the resonator shell, and by welding the shell to a solid post at a controlled location. The flowing of the shell and welding to the rod is performed in one step and in a single mold. This solid-stem resonator offers low anchor loss due to the large stem length/stiffness, and small shell rim thickness. The device has a shell radius/height of ~2.8 mm, and a stem radius of 0.5 mm. At <;10 μTorr vacuum, the n=2 wineglass mode, located at a frequency (f) of 22.6 kHz, has σ = 35.9 s and Q = 2.55 million.
  • Keywords
    Q-factor; blow moulding; microfabrication; micromechanical resonators; shell casting; silicon compounds; welding; SiO2; fabrication technology; frequency 22.6 kHz; high quality factor; high-Q all-fused silica solid-stem wineglass hemispherical resonator; large stem length-stiffness; long ring down time; low anchor loss; microFS wineglass resonator; microblow torching; microwelding; multiple FS structures; resonator shell; single mold; size 0.5 mm; small shell rim thickness; solid-stem resonator; thin FS substrate; time 35.9 s; vacuum; Electric shock; Scanning electron microscopy; Solids; Substrates; Vibrations; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
  • Conference_Location
    Estoril
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2015.7051085
  • Filename
    7051085