• DocumentCode
    1874864
  • Title

    Aspect Ratio Dependent Scalloping Attenuation in Drie and an Application to Low-Loss Fiber-Optical Switches

  • Author

    Mita, Yoshio ; Sugiyama, Masakazu ; Kubota, Masanori ; Marty, Frederic ; Bourouina, Tarik ; Shibata, Tadashi

  • Author_Institution
    Department of Electrical Engineering, The University of Tokyo, Shibata-Mita Laboratory, Bunkyoku Yayoi 2-11-16-E10-490, Tokyo 113-0032 JAPAN., Tel/Fax: ++81-3-5841-6730, E-Mail: mita@ee.t.u-tokyo.ac.jp
  • fYear
    2006
  • fDate
    2006
  • Firstpage
    114
  • Lastpage
    117
  • Abstract
    The scalloping in the Bosch’s process[ 1] attenuates dependently on the aspect ratio: The scalloping factor, undercut length ludivided by etched depth in each Bosch’s cycle ld, attenuates drastically from the depth where the aspect ratio exceeds 1:1. The phenomenon is not found in the case of large openings at the same depth. Theoretical reason can be attributed to the transportation limit of radicals. This Aspect-Ratio-Dependent-Scalloping-Attenuation (ARDSA) is useful for the applications in which scallop-free surface is crucial, such as fiber-optical switches[ 2]. A simple two-step DRIE, proposed as a contour-lithography method[ 3], can make use of the ARDSA: By firstly etching the scalloping-critical surface using narrow trench openings and dummy structures and secondly etch the dummy, microstructure having scallop-free walls are obtainable. The authors studied scalloping attenuation dependency through trenches having the openings from sub-micron to hundreds of microns. After which a fiber-optical reflector having scallop-free vertical walls was fabricated. Scallop-free surfaces made by the contour lithography method showed +2.4dB better reflectivity.
  • Keywords
    Attenuation; Etching; Laboratories; Lithography; Microstructure; Passivation; Reflectivity; Sulfur hexafluoride; Switches; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
  • Conference_Location
    Istanbul, Turkey
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-9475-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2006.1627749
  • Filename
    1627749