Crosstalk in coupled interconnects with meshed ground planes

Author

Luo, Sifen ; Jyh-Ming Jang ; Tripathi, Vijai K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

fYear

1994

fDate

15-17 Mar 1994

Firstpage

132

Lastpage

137

Abstract

A method for the time domain simulation of coupled interconnects in a layered medium with meshed ground planes is presented. The method, based on the quasi-TEM spectral domain analysis of the layered structure and the SPICE model consisting of delay elements and linear dependent sources, is used to study crosstalk in coupled interconnects. The theoretical results are validated by experimental data, and it is shown that the presence of slots and meshes in ground planes can reduce the far-end crosstalk in coupled interconnects

Keywords

SPICE; crosstalk; matrix algebra; multichip modules; spectral-domain analysis; time-domain analysis; transmission line theory; MCM; SPICE model; coupled interconnects; delay elements; far-end crosstalk; layered medium; linear dependent sources; meshed ground planes; quasi-TEM spectral domain analysis; slots; time domain simulation; Capacitance; Coupled mode analysis; Crosstalk; Equations; Green´s function methods; Integrated circuit interconnections; Power system interconnection; Power transmission lines; Transmission line matrix methods; Transmission line theory;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-5560-7

Type

conf

DOI

10.1109/MCMC.1994.292514

Filename

292514