DocumentCode
1874913
Title
Modeling of Delta-I noise in digital electronics packaging
Author
Chen, Yuzhe ; Wu, Zhonghua ; Agrawal, Amit ; Liu, Yaowu ; Fang, Jiayuan
Author_Institution
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1994
fDate
15-17 Mar 1994
Firstpage
126
Lastpage
131
Abstract
Delta-I noise, which refers to the voltage fluctuations between power and ground conductors caused by sudden current surges, has been well recognized as a limiting factor for the reliable operation of high-speed integrated circuits. A novel technique for modeling Delta-I noise associated with power and ground planes is presented in this paper. This new approach considers not only the wave propagation and resonance in power and ground planes, also the geometry of the interconnections such as the via radius, which results in accurate prediction of the Delta-I noise waveforms. An electromagnetic field solver is employed to model the power/ground planes connected with vias, and is linked to SPICE type circuit solvers to analyze the components off the planes. This simulation technique is found to be very fast in computation speed and also highly accurate. Simulation results are provided together with a comparison of Delta-I analysis performed by the method of this paper and IBM´s ASTAP
Keywords
SPICE; circuit analysis computing; digital circuits; modelling; packaging; surges; transient response; Delta-I noise; SPICE type circuit solvers; digital electronics packaging; electromagnetic field solver; ground planes; high-speed integrated circuits; noise waveforms; power planes; resonance; simulation technique; via connection; voltage fluctuations; wave propagation; Circuit simulation; Computational modeling; Conductors; Electromagnetic propagation; Electronics packaging; High speed integrated circuits; Integrated circuit noise; Integrated circuit reliability; Surges; Voltage fluctuations;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-5560-7
Type
conf
DOI
10.1109/MCMC.1994.292515
Filename
292515
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