DocumentCode :
1874913
Title :
Modeling of Delta-I noise in digital electronics packaging
Author :
Chen, Yuzhe ; Wu, Zhonghua ; Agrawal, Amit ; Liu, Yaowu ; Fang, Jiayuan
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fYear :
1994
fDate :
15-17 Mar 1994
Firstpage :
126
Lastpage :
131
Abstract :
Delta-I noise, which refers to the voltage fluctuations between power and ground conductors caused by sudden current surges, has been well recognized as a limiting factor for the reliable operation of high-speed integrated circuits. A novel technique for modeling Delta-I noise associated with power and ground planes is presented in this paper. This new approach considers not only the wave propagation and resonance in power and ground planes, also the geometry of the interconnections such as the via radius, which results in accurate prediction of the Delta-I noise waveforms. An electromagnetic field solver is employed to model the power/ground planes connected with vias, and is linked to SPICE type circuit solvers to analyze the components off the planes. This simulation technique is found to be very fast in computation speed and also highly accurate. Simulation results are provided together with a comparison of Delta-I analysis performed by the method of this paper and IBM´s ASTAP
Keywords :
SPICE; circuit analysis computing; digital circuits; modelling; packaging; surges; transient response; Delta-I noise; SPICE type circuit solvers; digital electronics packaging; electromagnetic field solver; ground planes; high-speed integrated circuits; noise waveforms; power planes; resonance; simulation technique; via connection; voltage fluctuations; wave propagation; Circuit simulation; Computational modeling; Conductors; Electromagnetic propagation; Electronics packaging; High speed integrated circuits; Integrated circuit noise; Integrated circuit reliability; Surges; Voltage fluctuations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
Type :
conf
DOI :
10.1109/MCMC.1994.292515
Filename :
292515
Link To Document :
بازگشت