• DocumentCode
    1874913
  • Title

    Modeling of Delta-I noise in digital electronics packaging

  • Author

    Chen, Yuzhe ; Wu, Zhonghua ; Agrawal, Amit ; Liu, Yaowu ; Fang, Jiayuan

  • Author_Institution
    Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
  • fYear
    1994
  • fDate
    15-17 Mar 1994
  • Firstpage
    126
  • Lastpage
    131
  • Abstract
    Delta-I noise, which refers to the voltage fluctuations between power and ground conductors caused by sudden current surges, has been well recognized as a limiting factor for the reliable operation of high-speed integrated circuits. A novel technique for modeling Delta-I noise associated with power and ground planes is presented in this paper. This new approach considers not only the wave propagation and resonance in power and ground planes, also the geometry of the interconnections such as the via radius, which results in accurate prediction of the Delta-I noise waveforms. An electromagnetic field solver is employed to model the power/ground planes connected with vias, and is linked to SPICE type circuit solvers to analyze the components off the planes. This simulation technique is found to be very fast in computation speed and also highly accurate. Simulation results are provided together with a comparison of Delta-I analysis performed by the method of this paper and IBM´s ASTAP
  • Keywords
    SPICE; circuit analysis computing; digital circuits; modelling; packaging; surges; transient response; Delta-I noise; SPICE type circuit solvers; digital electronics packaging; electromagnetic field solver; ground planes; high-speed integrated circuits; noise waveforms; power planes; resonance; simulation technique; via connection; voltage fluctuations; wave propagation; Circuit simulation; Computational modeling; Conductors; Electromagnetic propagation; Electronics packaging; High speed integrated circuits; Integrated circuit noise; Integrated circuit reliability; Surges; Voltage fluctuations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-5560-7
  • Type

    conf

  • DOI
    10.1109/MCMC.1994.292515
  • Filename
    292515