Are there any alternatives to “known good die” ? [MCMs]

Author

Gattiker, Anne E. ; Maly, Wojciech ; Thomas, Michael E.

Author_Institution

Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

fYear

1994

fDate

15-17 Mar 1994

Firstpage

102

Lastpage

107

Abstract

This paper presents a cost-based methodology for assessing the effectiveness of various MCM implementation strategies. It is focused on testing. Two approaches to the MCM testing problem are investigated in detail. One is based on the assumption that system components are perfect(“known good die” approach) and the other uses the “smart substrate” concept. An MCM using a smart substrate is one in which the substrate contains active circuitry for carrying out testing functions. For these two testing options, the obtained results suggest the existence of “windows of opportunity” for both KGD and smart substrate solutions

Keywords

built-in self test; costing; economics; integrated circuit manufacture; integrated circuit testing; multichip modules; MCM implementation strategies; MCM testing; active circuitry; cost model; cost-based methodology; known good die concept; smart substrate; Assembly; Circuit testing; Controllability; Costs; Environmental economics; Manufacturing; Observability; Packaging; Pins; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-5560-7

Type

conf

DOI

10.1109/MCMC.1994.292519

Filename

292519