Silicon microprobing array for testing and burn-in

A silicon microprobing array made by the micromachining technique is proposed for testing and burn-in at the die level. The microprobing array is made on a silicon substrate to avoid misalignment caused by mismatching of the thermal expansion rates. The die to be tested is placed face down on the microprobing array surface, and compliance in the direction perpendicular to the substrate is realized by means of a membrane covering a microcavity in the silicon substrate. A microprobing array was successfully fabricated, and a basic contact experiment showed that it can establish good contact even at high temperatures. A contact resistivity of 0.5 Ω was measured, and burn-in was successfully carried out at the die level