• DocumentCode
    1875078
  • Title

    Air-coupled aluminum nitride piezoelectric micromachined ultrasonic transducers at 0.3 MHz TO 0.9 MHz

  • Author

    Rozen, Ofer ; Block, Scott T. ; Shelton, Stefon E. ; Przybyla, Richard J. ; Horsley, David A.

  • Author_Institution
    Univ. of California, Davis, Davis, CA, USA
  • fYear
    2015
  • fDate
    18-22 Jan. 2015
  • Firstpage
    921
  • Lastpage
    924
  • Abstract
    Air-coupled piezoelectric micromachined ultrasonic transducers (PMUTs) operating at frequencies ranging from 0.3 MHz to 0.9 MHz were designed, fabricated and characterized. We increased the fractional bandwidth by 51% and improved the piezoelectric coupling over 80% by patterning the diaphragm center into a ring or structural ribs, resulting in a reduction of the PMUT´s mass. Pulse-echo testing was conducted in air using PMUTs at frequencies up to 0.9 MHz and the measured acoustic loss versus pathlength was compared to theoretical models. Devices were fabricated in an industrial foundry process using wafer-level bonding of a MEMS PMUT wafer to a CMOS wafer using a conductive metal eutectic bond. This process allows for close integration of PMUT arrays and signal processing circuitry and is used here to study the effects of wafer-level packaging on acoustic performance.
  • Keywords
    CMOS integrated circuits; aluminium compounds; micromachining; micromechanical devices; ultrasonic transducers; wafer bonding; wafer level packaging; AlN; CMOS wafer; MEMS wafer; PMUT arrays; acoustic performance; air-coupled piezoelectric micromachined ultrasonic transducers; conductive metal eutectic bond; diaphragm center patterning; frequency 0.3 MHz to 0.9 MHz; industrial foundry process; piezoelectric coupling; pulse-echo testing; ring ribs; signal processing circuitry; structural ribs; wafer-level bonding; wafer-level packaging; Acoustics; CMOS integrated circuits; Cavity resonators; Frequency measurement; Micromechanical devices; Q-factor; Ribs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
  • Conference_Location
    Estoril
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2015.7051110
  • Filename
    7051110