Title :
A novel light emitting device based on Si nanostructures and tunneling injection of carriers
Author :
Wong, H. ; Filip, V. ; Chu, P.L.
Author_Institution :
Dept. of Electron. Eng. & Optoelectronics Res. Centre, Hong Kong City Univ., Kowloon, China
Abstract :
Silicon was not used for light emitting devices (LEDs) as it is an indirect bandgap material and has very low radiative recombination rate and short photon lifetime. This fundamental material property limitation has been overcome. Recent efforts have demonstrated that the light emitting efficiency can be enhanced greatly and lasing effect is also possible with the low-dimensional (LD) silicon materials. In this work, a novel light- emitting device structure based on Si/SiO2/LD Si/Si3N4/Si system is proposed. The low-dimensional Si governed the photon generation efficiency and energy spectrum whereas the asymmetry barrier heights formed by the SiO2 and Si3N4 provide high efficiency carrier injection based on direct tunneling and maximizes the recombination events taking place in the LD Si region. Quantum calculations on the charge transports, including the direct tunneling carrier injection at the Si/SiO2 interface and band-to-band recombination of in the LD Si, were conducted.
Keywords :
charge injection; electron-hole recombination; elemental semiconductors; light emitting devices; nanostructured materials; photon production; silicon; silicon compounds; tunnelling; LD materials; Si-Si3N4; Si-SiO2; asymmetry barrier heights; band-to-band recombination; carrier tunneling injection; charge transport; energy spectrum; low-dimensional materials; novel nanostructure-based light emitting device; photon generation efficiency; quantum calculations; Light emitting diodes; Nanostructures; Optical materials; Photonic band gap; Quantum dot lasers; Radiative recombination; Silicon; Spontaneous emission; Tunneling; Voltage;
Conference_Titel :
Vacuum Nanoelectronics Conference, 2004. IVNC 2004. Technical Digest of the 17th International
Print_ISBN :
0-7803-8397-4
DOI :
10.1109/IVNC.2004.1354950