A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate

Author

Day, Ray-Long ; Hruska, Christopher D. ; Tai, King L. ; Frye, Robert C. ; Lau, Maureen Y. ; Sullivan, Paul A.

Author_Institution

AT&T Bell Labs., Lee´´s Summit, MO, USA

fYear

1994

fDate

15-17 Mar 1994

Firstpage

64

Lastpage

67

Abstract

To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM

Keywords

bipolar integrated circuits; elemental semiconductors; mixed analogue-digital integrated circuits; multichip modules; silicon; MCM substrate design; Si-Si; Si-on-Si multichip module technology; active device properties; double-diffused epitaxial bipolar technology; full custom design ASIC; integrated bipolar components; mixed signal applications; passive devices; thin-film MCMs; Assembly; Bipolar integrated circuits; Bipolar transistors; Cities and towns; Costs; Multichip modules; Resistors; Silicon; Substrates; Telephony;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-5560-7

Type

conf

DOI

10.1109/MCMC.1994.292525

Filename

292525