• DocumentCode
    1875154
  • Title

    Applications and design techniques for MCMs

  • Author

    Davidson, Evan E.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    1994
  • fDate
    15-17 Mar 1994
  • Firstpage
    50
  • Lastpage
    57
  • Abstract
    The multi-chip module (MCM) has yet to make its mark in the high volume computer arena but this situation should change soon. High chip and module connection densities are the drivers that will ultimately make MCMs the choice for many applications. Of course, for this to happen, they will have to be cost competitive when compared to alternative approaches. This, too, will happen. As a result, the art of designing an MCM will become a desirable skill. Designing an MCM is the first step in determining whether your application should include an MCM. This paper shows how to do that
  • Keywords
    economics; integrated circuit manufacture; multichip modules; MCM multiprocessor; MCMs; design techniques; high chip I/O density; high module connection density; multi-chip module; package economics; Application software; Costs; Electronics industry; IEEE news; Manufacturing; Microprocessors; Packaging; Production; Supercomputers; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-5560-7
  • Type

    conf

  • DOI
    10.1109/MCMC.1994.292527
  • Filename
    292527