Title :
Applications and design techniques for MCMs
Author :
Davidson, Evan E.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
The multi-chip module (MCM) has yet to make its mark in the high volume computer arena but this situation should change soon. High chip and module connection densities are the drivers that will ultimately make MCMs the choice for many applications. Of course, for this to happen, they will have to be cost competitive when compared to alternative approaches. This, too, will happen. As a result, the art of designing an MCM will become a desirable skill. Designing an MCM is the first step in determining whether your application should include an MCM. This paper shows how to do that
Keywords :
economics; integrated circuit manufacture; multichip modules; MCM multiprocessor; MCMs; design techniques; high chip I/O density; high module connection density; multi-chip module; package economics; Application software; Costs; Electronics industry; IEEE news; Manufacturing; Microprocessors; Packaging; Production; Supercomputers; Workstations;
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
DOI :
10.1109/MCMC.1994.292527