DocumentCode
1875154
Title
Applications and design techniques for MCMs
Author
Davidson, Evan E.
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
fYear
1994
fDate
15-17 Mar 1994
Firstpage
50
Lastpage
57
Abstract
The multi-chip module (MCM) has yet to make its mark in the high volume computer arena but this situation should change soon. High chip and module connection densities are the drivers that will ultimately make MCMs the choice for many applications. Of course, for this to happen, they will have to be cost competitive when compared to alternative approaches. This, too, will happen. As a result, the art of designing an MCM will become a desirable skill. Designing an MCM is the first step in determining whether your application should include an MCM. This paper shows how to do that
Keywords
economics; integrated circuit manufacture; multichip modules; MCM multiprocessor; MCMs; design techniques; high chip I/O density; high module connection density; multi-chip module; package economics; Application software; Costs; Electronics industry; IEEE news; Manufacturing; Microprocessors; Packaging; Production; Supercomputers; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-5560-7
Type
conf
DOI
10.1109/MCMC.1994.292527
Filename
292527
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