Title :
Characterization of net configurations for multichip modules
Author :
Okada, Takashi ; Sudo, Toshio
Author_Institution :
Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
Abstract :
An investigation of the design considerations for MCMs based on CMOS VLSI has been carried out with the aim of achieving a higher performance system. Included in the investigation were output driver and receiver characteristics and net configurations in MCM. Four MCM types have been introduced: MCM-D, MCM-Si, MCM-C, and MCM-L. Time domain analysis using the SPICE simulation program was carried out taking into consideration a lossy transmission line model. A simpler criterion for the critical damping condition and an estimation method for the signal delay of the network with a lumped circuit approximation is proposed to determine a preferable interconnect network including the output driver and the loads. The effect of the net configuration was also analyzed and the preferences among the net configurations have been represented with only two net parameters, the total net length and the far-end length
Keywords :
CMOS integrated circuits; SPICE; VLSI; delays; lumped parameter networks; multichip modules; time-domain analysis; transmission line theory; waveform analysis; CMOS VLSI; MCM-C; MCM-D; MCM-L; MCM-Si; SPICE simulation program; critical damping condition; design considerations; far-end length; lossy transmission line model; lumped circuit approximation; multichip modules; net configurations; output driver characteristics; preferable interconnect network; receiver characteristics; signal delay estimation; time domain analysis; total net length; waveform characterization; Analytical models; Circuit simulation; Damping; Delay estimation; Distributed parameter circuits; Multichip modules; Propagation losses; SPICE; Time domain analysis; Very large scale integration;
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
DOI :
10.1109/MCMC.1994.292530