• DocumentCode
    1875266
  • Title

    Characterization of net configurations for multichip modules

  • Author

    Okada, Takashi ; Sudo, Toshio

  • Author_Institution
    Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
  • fYear
    1994
  • fDate
    15-17 Mar 1994
  • Firstpage
    32
  • Lastpage
    37
  • Abstract
    An investigation of the design considerations for MCMs based on CMOS VLSI has been carried out with the aim of achieving a higher performance system. Included in the investigation were output driver and receiver characteristics and net configurations in MCM. Four MCM types have been introduced: MCM-D, MCM-Si, MCM-C, and MCM-L. Time domain analysis using the SPICE simulation program was carried out taking into consideration a lossy transmission line model. A simpler criterion for the critical damping condition and an estimation method for the signal delay of the network with a lumped circuit approximation is proposed to determine a preferable interconnect network including the output driver and the loads. The effect of the net configuration was also analyzed and the preferences among the net configurations have been represented with only two net parameters, the total net length and the far-end length
  • Keywords
    CMOS integrated circuits; SPICE; VLSI; delays; lumped parameter networks; multichip modules; time-domain analysis; transmission line theory; waveform analysis; CMOS VLSI; MCM-C; MCM-D; MCM-L; MCM-Si; SPICE simulation program; critical damping condition; design considerations; far-end length; lossy transmission line model; lumped circuit approximation; multichip modules; net configurations; output driver characteristics; preferable interconnect network; receiver characteristics; signal delay estimation; time domain analysis; total net length; waveform characterization; Analytical models; Circuit simulation; Damping; Delay estimation; Distributed parameter circuits; Multichip modules; Propagation losses; SPICE; Time domain analysis; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-5560-7
  • Type

    conf

  • DOI
    10.1109/MCMC.1994.292530
  • Filename
    292530