DocumentCode
1875343
Title
Quick-turnaround, low-cost MCM prototyping
Author
Demmin, J.
Author_Institution
nCHIP
fYear
1994
fDate
15-17 Mar 1994
Firstpage
7
Abstract
Summary form given, as follows. nCHIP´s ”quick-turnaround, low cost MCM prototyping” program is simplifying the development of new MCM designs by reducing the long cycle times and large non-recurring engineering (NRE) costs that have created a barrier to entry for many potential MCM users. Much of the time and expense for MCMs arises from the custom nature of most current MCM substrates and packages, as well as the design, manufacturing, and test procedures typical of a young industry. Consequently, the focus of this program is standardization. The effort includes: standard MCM packages and substrate sizes, MCM design kits for user generation and analysis of layouts, improved CAM interfaces linking design and manufacturing, standard MCM test flows, bare die procurement, and MCM component model libraries. Three development vehicles demonstrating the progress during the course of the program with real MCM designs are also included. The progress, current status, and future plans for all of these tasks are presented
Keywords
circuit layout; integrated circuit manufacture; integrated circuit testing; multichip modules; standardisation; CAM interfaces; MCM component model libraries; MCM design; bare die procurement; design kits; layouts; low-cost MCM prototyping; manufacturing; multichip module; packages sizes; quick-turnaround prototyping; standardization; substrate sizes; test procedures; CADCAM; Computer aided manufacturing; Costs; Design engineering; Joining processes; Manufacturing industries; Packaging; Prototypes; Standardization; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-5560-7
Type
conf
DOI
10.1109/MCMC.1994.292536
Filename
292536
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