• DocumentCode
    1875400
  • Title

    New mechanism of cluster field evaporation in rf breakdown

  • Author

    Insepov, Z. ; Norem, J.H. ; Hassanein, A.

  • Author_Institution
    Argonne Nat. Lab., IL, USA
  • fYear
    2004
  • fDate
    11-16 July 2004
  • Firstpage
    180
  • Lastpage
    181
  • Abstract
    The mechanism of "cold-emission" caused by high electric field gradients typical of future linacs is studied. The mechanism was studied by molecular dynamics (MD) simulation of a nanoscale copper tip on a surface of an rf-cavity electrode that is capable of revealing temperature effects. In this MD method, the equations of motion of interacting particles are solved numerically and appropriate initial and boundary conditions are applied. According to the results, the vacuum inside the high-gradient rf cavity should contain a noticeable presence of nanometer-size chunks that evaporated from various intrusions that exist on the real cavity surface by an rf field. A critical electrical evaporation field was obtained for temperatures that range from room up to the melting point of bulk Cu. The simulation results were compared with available data on FIM tip fracture in a dc electric field.
  • Keywords
    copper; electric breakdown; electrodes; field emission ion microscopy; field evaporation; linear accelerators; molecular dynamics method; Cu; FIM tip fracture; MD simulation; Molecular Dynamics simulation; boundary conditions; cluster field evaporation; cold-emission; critical electrical evaporation field; dc electric field; electric field gradients; equations of motion; linacs; nanometer-size chunks; nanoscale tip; rf breakdown; rf-cavity electrode; Copper; Electric breakdown; Electrooptical waveguides; Laboratories; Linear accelerators; Radio frequency; Surface cracks; Surface waves; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2004. IVNC 2004. Technical Digest of the 17th International
  • Print_ISBN
    0-7803-8397-4
  • Type

    conf

  • DOI
    10.1109/IVNC.2004.1354961
  • Filename
    1354961