DocumentCode :
1875661
Title :
Mechanical, Thermal, and Material Influences on Ohmic-Contact-Type MEMS Switch Operation
Author :
McGruer, N.E. ; Adams, G.G. ; Chen, L. ; Guo, Z.J. ; Du, Y.
Author_Institution :
Northeastern University, Boston, Massachusetts, USA
fYear :
2006
fDate :
2006
Firstpage :
230
Lastpage :
233
Abstract :
Microswitch performance and reliability are affected by the coupled influences of actuator properties, material and process properties, and device thermal properties. Different contact materials show large differences in immunity to contamination. Contact shape and the adherence force between contact surfaces both evolve as the contact pair is cycled, with the adherence force often reaching a maximum between 105and 107cycles for gold. A typical switch actuation with a step function voltage results in an contact impact force 5 times greater than the static force, increasing the adherence force and the rate of change of the shape of the contact. Heating of the conductors in the switch results in intermodulation products, which are small at a transmitted power of 1 W, but increase with increasing power levels.
Keywords :
Actuators; Contacts; Gold; Heating; Materials reliability; Microswitches; Shape; Surface contamination; Switches; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
Conference_Location :
Istanbul, Turkey
ISSN :
1084-6999
Print_ISBN :
0-7803-9475-5
Type :
conf
DOI :
10.1109/MEMSYS.2006.1627778
Filename :
1627778
Link To Document :
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