DocumentCode :
1876307
Title :
Reverse conduction of a 100 A SiC DMOSFET module in high-power applications
Author :
Wood, R.A. ; Urciuoli, D.P. ; Salem, T.E. ; Green, R.
Author_Institution :
U. S. Army Res. Lab., Adelphi, MD, USA
fYear :
2010
fDate :
21-25 Feb. 2010
Firstpage :
1568
Lastpage :
1571
Abstract :
Numerous research efforts over the past few years have documented the enhanced capabilities that Silicon Carbide (SiC) offers over Silicon based power electronic devices. Additional research work has led to vast improvements in the manufacturing of SiC based components. As a result, SiC power electronic components, primarily diodes, are now readily available and this technology promises to have widespread market impact as more complex device structures are commercially realized. Recently, the development of a 1200 V 50 A SiC DMOSFET device and its use in a 100 A power module has been documented. This paper extends that research work to report on the reverse conduction characteristics of the SiC DMOSFET and the system-level benefits for high-power applications that can be achieved by operating these devices in this manner. Experimental data is presented on the 100 A module consisting of two, 50 A SiC DMOSFETs and two, 50 A SiC JBS anti-parallel free-wheeling diodes used in a high-power bi-directional DC-DC converter during buck mode operation.
Keywords :
DC-DC power convertors; MOSFET; modules; power transistors; silicon compounds; wide band gap semiconductors; DMOSFET module; SiC; antiparallel free-wheeling diodes; bidirectional DC-DC converter; buck mode operation; current 100 A; current 50 A; power electronic components; power module; reverse conduction; silicon carbide; voltage 1200 V; Bidirectional control; DC-DC power converters; Light emitting diodes; Milling machines; Multichip modules; Powders; Power electronics; Silicon carbide; Switching converters; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE
Conference_Location :
Palm Springs, CA
ISSN :
1048-2334
Print_ISBN :
978-1-4244-4782-4
Electronic_ISBN :
1048-2334
Type :
conf
DOI :
10.1109/APEC.2010.5433440
Filename :
5433440
Link To Document :
بازگشت