Title :
Dense photonics integration on a micron-scale SOI waveguide platform
Author :
Aalto, Timo ; Cherchi, Matteo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami
Author_Institution :
VTT Tech. Res. Centre of Finland, Espoo, Finland
Abstract :
Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.
Keywords :
etching; integrated circuit bonding; integrated optoelectronics; optical waveguides; silicon-on-insulator; Si; compact circuits; dense photonic integration; etching; integrated optoelectronics; micron-scale SOI waveguide; size 3 mum to 12 mum; thermocompression bonding; thick SOI layers; Couplings; Optical losses; Optical waveguides; Photonics; Silicon; Silicon-on-insulator; Waveguide lasers; hybrid integration; photonic integrated circuit; silicon photonics; silicon-on-insulator; waveguide;
Conference_Titel :
Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-5803-3
DOI :
10.1109/Group4.2013.6644452
