DocumentCode :
187710
Title :
Soft error rate comparison of various hardened and non-hardened flip-flops at 28-nm node
Author :
Gaspard, N. ; Jagannathan, Sarangapani ; Diggins, Zachary J. ; Mahatme, N.N. ; Loveless, T.D. ; Bhuva, B.L. ; Massengill, Lloyd W. ; Holman, W.T. ; Narasimham, B. ; Oates, A. ; Marcoux, Pierre ; Tam, Nelson ; Vilchis, M. ; Wen, S.-J. ; Wong, Rita ; Xu, Y.
Author_Institution :
Vanderbilt Univ., Nashville, TN, USA
fYear :
2014
fDate :
1-5 June 2014
Abstract :
For flip-flop designs fabricated at advanced technology nodes, soft errors are expected to contribute significantly to the overall failure-in-time rates for electronic systems. Since the soft error rates are design and layout dependent, it is important to evaluate different flip-flop designs used in an electronic system. Alpha-particle, high-energy proton, neutron, and heavy-ion experimental results of 30 different flip-flop designed and manufactured in a 28-nm bulk CMOS process are presented in this paper. The results show the spectrum of soft error rates a system-level designer may see for hardened and non-hardened flip-flops at the 28-nm bulk CMOS technology node.
Keywords :
CMOS logic circuits; flip-flops; logic design; neutron effects; proton effects; radiation hardening (electronics); CMOS technology node; advanced technology nodes; alpha-particle; bulk CMOS process; electronic systems; failure-in-time rates; hardened flip-flop design; heavy-ion; high-energy proton; layout dependent; neutron; nonhardened flip-flop design; size 28 nm; soft error rate; system-level designer; Error analysis; Flip-flops; Integrated circuits; Neutrons; Protons; Shift registers; Single event upsets; flip-flop; single-event upset; soft error;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
Type :
conf
DOI :
10.1109/IRPS.2014.6861177
Filename :
6861177
Link To Document :
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