DocumentCode
187715
Title
Similarity and difference in temperature dependent recovery of HCS and NBTI
Author
Yonamoto, Y.
Author_Institution
Image Recognition & Inspection Syst. Dept., Hitachi Ltd., Yokohama, Japan
fYear
2014
fDate
1-5 June 2014
Abstract
We investigated the temperature dependence of recovery behavior in p-channel MOSFETs after subjected to hot carrier stress (HCS) and negative bias temperature stress (NBTS) from the recovery activation energy distributions of threshold voltage shifts (ErV) and of interface states (ErD). Both ErV and ErD are composed of the two elements, so-called recoverable- and permanent components (R and P). We found that the temperature dependent recovery after HCS and NBTS can be interpreted by R and P. In addition, the degradation mechanism, i.e., origins of R and P, was discussed. This study sheds light on the high temperature degradation mechanism.
Keywords
MOSFET; hot carriers; negative bias temperature instability; stress analysis; HCS; NBTI; high temperature degradation mechanism; hot carrier stress; interface state; negative bias temperature stress; p-channel MOSFET; permanent component; recoverable-component; recovery activation energy distribution; temperature dependent recovery; threshold voltage shift; Degradation; Erbium; MOSFET; Reliability; Stress; Temperature dependence; Temperature measurement; HCS; NBTI; energy distribution; recovery;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6861179
Filename
6861179
Link To Document