DocumentCode
1878167
Title
Novel packaging of parallel-optical interconnects for high-end servers
Author
Rosenau, Steven A. ; Simon, Jonathan ; Windover, Lisa A Buckman ; Law, Benjamin ; Flower, Graham M. ; DeGroot, Edwin ; Grot, Annette ; Nystrom, Michael J. ; Lin, Cbao-Kun ; Tandon, Ashish ; Djordjev, Kostadin ; Tan, Michael R T ; Mirkarimi, Laura W. ; Gru
Author_Institution
Agilent Labs., Agilent Technol., Palo Alto, CA, USA
Volume
4
fYear
2005
fDate
6-11 March 2005
Abstract
A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio <1.5×10-15 was measured at 8 Gbit/s.
Keywords
error statistics; optical interconnections; packaging; 8 Gbit/s; high-end servers; novel packaging; parallel-optical interconnects; parallel-optical subassemblies; processor chips; processor-to-processor communication; single-channel bit-error ratio; substrate; Aggregates; Bandwidth; Connectors; Design optimization; Integrated circuit interconnections; Laboratories; Open source hardware; Optical interconnections; Packaging; Routing;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference, 2005. Technical Digest. OFC/NFOEC
Print_ISBN
1-55752-783-0
Type
conf
DOI
10.1109/OFC.2005.193028
Filename
1501567
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