DocumentCode
1878563
Title
Fabrication Ofrigid Backplate Condensermicrophone Using Drie and Wafer Bonding Technology
Author
Lee, Kwang-Cheol ; Kwon, Hyu-sang
Author_Institution
Electronic Devices Group, Korea Research Institute of Standards and Science (KRISS), Korea
fYear
2006
fDate
2006
Firstpage
650
Lastpage
653
Abstract
This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The 2 mm × 2 mm, 150-μm-thick backplate is fabricated using silicon deep reactive ion etching from backplate wafer, where 50~60-μm radius cylindrical acoustic holes are also fabricated to reduce air damping. The microphone sensitivity is 39.8 μV/Pa (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 2 dB between 20 Hz and 5 kHz.
Keywords
Biomembranes; Damping; Etching; Fabrication; Gold; Micromechanical devices; Microphones; Silicon; Tin; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
Conference_Location
Istanbul, Turkey
ISSN
1084-6999
Print_ISBN
0-7803-9475-5
Type
conf
DOI
10.1109/MEMSYS.2006.1627883
Filename
1627883
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