Title :
3-Axes Flexible Tactile Sensor Fabricated by Si Micromachining and Packaging Technology
Author :
Kim, K. ; Lee, K.R. ; Kim, Y.K. ; Lee, D.S. ; Cho, N.K. ; Kim, W.-H. ; Park, K.-B. ; Park, H.D. ; Park, Y.K. ; Kim, J.H. ; Pak, J.J.
Author_Institution :
Nano Mechatronics Research Center, Korea Electronics Technology Institute, KOREA, Department of Electronics and Computer Engineering, Korea University, KOREA
Abstract :
We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip.
Keywords :
Electrical resistance measurement; Fabrication; Force measurement; Force sensors; Micromachining; Pressure measurement; Semiconductor device packaging; Sensor phenomena and characterization; Strain measurement; Tactile sensors;
Conference_Titel :
Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
Conference_Location :
Istanbul, Turkey
Print_ISBN :
0-7803-9475-5
DOI :
10.1109/MEMSYS.2006.1627890