DocumentCode
1878924
Title
Insulating layer parameters are still in reduction of kink
Author
Agarwal, A.P.K. ; Pradhan, B.K.P. ; Mohapatra, C.S.K. ; Sahu, D.P.K.
fYear
2012
fDate
6-8 Dec. 2012
Firstpage
1
Lastpage
4
Abstract
Semiconductor devices using selective buried oxide (SELBOX) substrate is an area of promising technology that has the capacity to exhibit high performance and overcome the drawbacks of floating body effects that affect the SOI devices. This paper presents numerical simulation results of MOSFETs on SELBOX structure and compares the electrical characteristics of device with those of devices on SOI and bulk silicon substrates. The simulation results show that the drain current kink effect, a physical phenomenon responsible for substrate floating body devices is completely suppressed above a certain drain voltage while preserving the useful advantages of SOI MOSFETs at the same time. The physical phenomenon responsible and method of minimizing kink effect with variation of different parameters is also specified.
Keywords
MOSFET; numerical analysis; semiconductor device models; silicon-on-insulator; MOSFET; SELBOX substrate; SOI devices; Si; bulk silicon substrates; drain current kink effect; floating body devices; floating body effects; insulating layer parameters; kink reduction; numerical simulation; selective buried oxide; semiconductor devices; Device Simulation; PD-SOI; SELBOX Substrate; SILVACO; floating body effects;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering (NUiCONE), 2012 Nirma University International Conference on
Conference_Location
Ahmedabad
Print_ISBN
978-1-4673-1720-7
Type
conf
DOI
10.1109/NUICONE.2012.6493247
Filename
6493247
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