Title :
Modeling the die attach adhesives process
Author :
Taweeplengsangsuke, J. ; Hsiung, J.-C. ; Pearson, R.A.
Author_Institution :
Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
Abstract :
Multi-step curing was performed to reduce the residual cure stress in the polymeric adhesives. The longer the period of time at the lower temperature step of the 2-step curing gave the lower cure stress. In addition, the stress during the cool down process was investigated. At the point of decreasing temperature, the stress dramatically increases. The higher temperature difference, the larger the residual stress
Keywords :
adhesion; internal stresses; microassembling; plastic packaging; thermal stresses; adhesion; bindability diagram; cool down process; die attach adhesives process; epoxy adhesives; isothermal stress; modeling; multi-step curing; polymeric adhesives; residual cure stress; Bonding; Conducting materials; Curing; Microassembly; Packaging; Polymers; Solvents; Stress; Temperature; Thermal conductivity;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664455
