DocumentCode
1879964
Title
1.3 μm BH-FP laser with integrated monitor photodiode, 45° reflector for bottom side emission employing full on-wafer fabrication
Author
Janiak, K. ; Albrecht, P. ; Fidorra, S. ; Heidrich, H. ; Rehbein, W. ; Roehle, H. ; Althaus, H.-L.
Author_Institution
Heinrich-Hertz-Inst. fur Nachrichtentech. Berlin GmbH, Germany
fYear
2002
fDate
2002
Firstpage
31
Lastpage
34
Abstract
We report on a 1.3 μm FP-BH laser with monolithically integrated monitor photodiode and 45° reflector for bottom side emission of the laser light. The devices are fabricated by employing a full on-wafer process including the formation of laser facets and the deposition of the high/antireflective coatings. Besides the possibility of on-wafer characterization, this device with its bottom side optical emission opens the way for the fabrication of low-cost optoelectronic modules based on semiconductor SMT-package technique.
Keywords
Fabry-Perot resonators; antireflection coatings; laser cavity resonators; photodiodes; semiconductor device packaging; semiconductor lasers; surface mount technology; 1.3 micron; SMT-package technique; antireflective coatings; bottom side emission; full on-wafer fabrication; integrated monitor photodiode; laser facets; low-cost optoelectronic modules; Chemical lasers; Etching; Indium phosphide; Laser beams; Monitoring; Photodiodes; Rough surfaces; Surface roughness; Surface-mount technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
ISSN
1092-8669
Print_ISBN
0-7803-7320-0
Type
conf
DOI
10.1109/ICIPRM.2002.1014086
Filename
1014086
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