Title :
Overview of advanced composites for thermal management
Author_Institution :
Lockheed Missiles & Space Co. Inc., King of Prussia, PA, USA
Abstract :
A variety of new, advanced composites are now available which provide great advantages over conventional materials for thermal control and electronic packaging. This brief paper provides an overview of advanced composites used in thermal management, including properties, applications and future trends. The focus is on materials that have thermal conductivities that are at least as high as those of aluminum alloys
Keywords :
composite materials; packaging; composite material; electronic packaging; thermal management;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664458
