Title :
Power surface mount components for high reliability applications
Author :
O´Connor, Michael ; Blackstone, Scott
Author_Institution :
Unitrode Corp., Watertown, MA, USA
Abstract :
Surface mount technology applications for power circuit assembly are discussed. In addition to discrete power surface mount components, it is also possible to purchase user-defined assemblies of power surface mount components which can be assembled using conventional discrete assembly techniques. These surface mount techniques have produced power supplies which are low profile with a high power density. In this work, the various power hermetic surface mount offerings are reviewed and compared to the conventional discrete and hybrid versions. In addition, the surface mount assembly process for these high-power components is reviewed, and the thermal and electrical requirements are discussed.<>
Keywords :
circuit reliability; power supply circuits; surface mount technology; discrete power surface mount components; electrical requirements; high power density; high reliability; power circuit assembly; power hermetic surface mount; power supplies; power surface mount components; surface mount technology; thermal requirements; user-defined assemblies; Assembly; Circuits; Costs; Frequency; Hybrid power systems; Rectifiers; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device reliability; Surface-mount technology;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1990. APEC '90, Conference Proceedings 1990., Fifth Annual
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/APEC.1990.66446
