DocumentCode
1880692
Title
Thermal resistance characterization of 200 GHz Ft InGaAs/InAlAs HBTs
Author
Fields, C.H. ; Foschaar, J. ; Thomas, S.
Author_Institution
HRL Labs., Malibu, CA, USA
fYear
2002
fDate
2002
Firstpage
79
Lastpage
82
Abstract
We present the results of measurements of the thermal resistivity of InP-based HBTs with cutoff frequencies, ft ∼200 GHz and with fmax over 300 GHz. The measurements were on full-thickness 3" InP wafers at Tamb from 30 - 210°C and three separate emitter current densities. We present data on three device sizes and two device layouts and discuss the relationship of Vbe to temperature at these elevated power and temperature levels.
Keywords
III-V semiconductors; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; indium compounds; millimetre wave bipolar transistors; semiconductor device measurement; thermal resistance; 200 GHz; 3 in; 30 to 210 degC; InGaAs-InAlAs; InGaAs/InAlAs HBTs; device layouts; device sizes; elevated power levels; elevated temperature levels; emitter current densities; full-thickness InP wafers; thermal resistance characterization; thermal resistivity; Conductivity; Current density; Current measurement; Cutoff frequency; Density measurement; Electrical resistance measurement; Frequency measurement; Indium phosphide; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
ISSN
1092-8669
Print_ISBN
0-7803-7320-0
Type
conf
DOI
10.1109/ICIPRM.2002.1014116
Filename
1014116
Link To Document