Title :
Integration using the hybrid silicon platform
Author :
Bowers, John E. ; Chen, Hui-Wen ; Liang, Di ; Oakley, Douglas C. ; Napoleone, Antonio ; Chapman, David C. ; Chen, Chang-Lee ; Juodawlkis, Paul W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
Abstract :
A brief review of recent progress in photonic integrated circuits (PIC) and connection to the electronic IC roadmap is presented. High-quality wafer bonding, electrically pumped lasers and high speed modulators are essential technologies for high speed interconnects and mass production of optoelectronics.
Keywords :
electro-optical modulation; integrated optics; integrated optoelectronics; silicon; wafer bonding; Si; hybrid silicon platform; photonic integrated circuits; wafer bonding; Conducting materials; Consumer electronics; III-V semiconductor materials; Indium phosphide; Integrated circuit technology; Optical materials; Photonic integrated circuits; Silicon; Substrates; Wafer bonding;
Conference_Titel :
Optical Communication, 2009. ECOC '09. 35th European Conference on
Conference_Location :
Vienna
Print_ISBN :
978-1-4244-5096-1
