Title :
Large Area Silicon Carbide Vertical Junction Field Effect Transistors for High Temperature Power Conditioning Applications
Author :
Veliadis, Victor ; McNutt, Ty ; McCoy, Megan ; Hearne, Harold ; Potyraj, Paul ; Scozzie, Charles
Author_Institution :
Northrop Grumman Corp., Linthicum, MD
Abstract :
SiC VJFETs are excellent candidates for reliable high power/temperature switching as they only use PN junctions in the active device area where the high electric fields occur. VJFETs do not suffer from forward voltage degradation, exhibit excellent short circuit performance, and operate at 300degC. 0.19 cm2 1200 V normally-on and 0.15 cm2 low-voltage normally- off VJFETs were fabricated. The 1200 V VJFET outputs 53 A with a forward drain voltage drop of 2 V and a low specific on-state resistance of 5.6 mOmega cm2. The low-voltage VJFET outputs 38 A with a forward drain voltage drop of 3 V and a specific on- state resistance of 10 mOmega cm2. The 1200 V SiC VJFET was connected in the cascode configuration with a Si MOSFET and with a low-voltage SiC VJFET to form normally-off power switches. At a forward drain voltage drop of 2 V, the SiC/MOSFET cascode switch outputs 31 A and the all-SiC cascode switch outputs 19 A.
Keywords :
elemental semiconductors; high-temperature electronics; junction gate field effect transistors; power MOSFET; power semiconductor switches; semiconductor device reliability; silicon; silicon compounds; wide band gap semiconductors; MOSFET; Si; SiC; VJFET; current 19 A; current 31 A; current 38 A; current 53 A; electric fields; forward drain voltage drop; high temperature switching; power conditioning application; vertical junction field effect transistor; voltage 1200 V; Circuit optimization; Degradation; FETs; MOSFET circuits; Power MOSFET; Power conditioning; Silicon carbide; Switches; Temperature; Voltage; 1200 V blocking; Vertical junction field effect transistor; cascode switch; power transistors; silicon carbide;
Conference_Titel :
Vehicle Power and Propulsion Conference, 2007. VPPC 2007. IEEE
Conference_Location :
Arlington, TX
Print_ISBN :
978-0-7803-9760-6
Electronic_ISBN :
978-0-7803-9761-3
DOI :
10.1109/VPPC.2007.4544129