DocumentCode
1882058
Title
High breakdown voltage In0.52Al0.48As/In0.53Ga0.47As metamorphic HEMT using InxGa1-xP graded buffer
Author
Yuan, K. ; Radhakrishnan, K.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fYear
2002
fDate
2002
Firstpage
161
Lastpage
164
Abstract
Metamorphic In0.52Al0.48As/In0.53Ga0.47As HEMT grown on GaAs with InxGa1-xP (x=0.48→1) graded buffer layer is reported. In this design the In0.53Ga0.47As channel layer was grown on top of the InGaP graded buffer directly without an InAlAs buffer as in the conventional design. The device shows high breakdown voltage: the measured on-state and off-state breakdown voltage are 11 V and 23 V, respectively, at a gate current of 0.1 mA/mm. The impact ionization rate and its dependence on temperature is also measured and analyzed, and the possible mechanism of the high breakdown voltage achieved is discussed. The metamorphic HEMT shows promising performance for its potential in power applications.
Keywords
III-V semiconductors; aluminium compounds; gallium arsenide; gallium compounds; impact ionisation; indium compounds; power HEMT; semiconductor device breakdown; 11 V; 23 V; In0.52Al0.48As-In0.53Ga0.47As; In0.53Ga0.47As channel layer; InxGa1-xP graded buffer; InGaP; MHEMTs; high breakdown voltage; impact ionization rate; metamorphic HEMT; power applications; Buffer layers; Current measurement; Gallium arsenide; HEMTs; Impact ionization; Indium compounds; Temperature dependence; Temperature measurement; Voltage measurement; mHEMTs;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
ISSN
1092-8669
Print_ISBN
0-7803-7320-0
Type
conf
DOI
10.1109/ICIPRM.2002.1014170
Filename
1014170
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