A fundamental study on silver flakes for conductive adhesives

Author

Lu, Daoqiang ; Wong, C.P. ; Tong, Quinn K.

Author_Institution

Dept. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

15-18 Mar 1998

Firstpage

256

Lastpage

260

Abstract

Silver (Ag) flakes are widely used as fillers for electrically conductive adhesives (ECAs). The Ag flakes need to be pretreated with organic lubricants to ensure the proper rheology of the ECAs. Lubricants on the Ag flakes influence rheology, conductivity and other properties of ECAs. The surface composition of a Ag flake was investigated by X-ray photoelectron spectroscopy. The nature of the lubricant on a Ag flake and the interaction between the lubricant and Ag flake surface were studied by diffuse reflectance infrared spectroscopy. Thermal decomposition of the lubricant was also studied by differential scanning calorimetry. In addition, the effects of some chemical compounds on lubricant removal were also investigated

Keywords

X-ray photoelectron spectra; adhesion; bonds (chemical); conducting polymers; filled polymers; infrared spectra; lubrication; packaging; particle size; pyrolysis; reflectivity; scanning electron microscopy; silver; surface chemistry; surface structure; thermal analysis; Ag; Ag flakes; SEM; XPS; bonding; chemical compounds effect; differential scanning calorimetry; diffuse reflectance infrared spectra; electrical conductivity; electrically conductive adhesives; exothermic peak; fatty acid chemical nature; fillers; lubricant removal; metal filled polymers; particle size; pretreated with organic lubricants; rheology; surface composition; thermal decomposition; Calorimetry; Conductive adhesives; Conductivity; Infrared spectra; Lubricants; Reflectivity; Rheology; Silver; Spectroscopy; Thermal decomposition;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-4795-1

Type

conf

DOI

10.1109/ISAPM.1998.664466

Filename

664466