DocumentCode
1882307
Title
Polymer bonded soft magnetics for EMI filter applications in power electronics
Author
Egelkraut, S. ; Frey, L. ; Rauch, M. ; Schletz, A. ; März, M.
Author_Institution
Dept. of Electron Devices, Univ. of Erlangen-Nuremberg, Erlangen, Germany
fYear
2010
fDate
21-25 Feb. 2010
Firstpage
231
Lastpage
238
Abstract
In this study, polymer bonded soft magnetic materials (PBSMM) were investigated for the application as a magnetic core and electromagnetic shielding material in inductive devices for EMI filter applications. The nature of switch mode power converters makes them a potential source of EMI noise emission. EMI filters are generally necessary to ensure electromagnetic compatibility of converters to the other electronic equipment. Conventional discrete EMI filters usually comprise passive components with different volume and form factors. The manufacturing of conventional inductive components requires different processing and packaging technologies, of which many include cost intensive processing steps. Due to the parasitics of the discrete components and their interconnections the effective filter frequency range is limited. As a result discrete EMI filters are usually not integrable into an arbitrary formed volume and show relative high production costs. This study aims on solving this issue by the integration of inductive EMI filter components using polymer bonded soft magnetics. PBSMMs were produced using thermoplastic polyamide 6 matrix materials. The filler materials were chosen from the wide range of different soft magnetics. The magnetic properties were characterized using injection molded ring core test specimens and a computer controlled hysteresis recorder as well as an impedance analyzer. Inductive devices with PBSMM as magnetic core have great potentials in automotive applications that have to meet a high geometric flexibility and highest power densities.
Keywords
electromagnetic compatibility; electromagnetic interference; electromagnetic shielding; noise; polymers; power convertors; power electronics; soft magnetic materials; EMI noise emission; automotive application; computer controlled hysteresis recorder; electromagnetic compatibility; electromagnetic shielding material; electronic equipment; filler materials; impedance analyzer; inductive EMI filter component; inductive devices; injection molded ring core test specimen; magnetic core; polymer bonded soft magnetic materials; power electronics; switch mode power converter; thermoplastic polyamide 6 matrix materials; Bonding; Electromagnetic interference; Magnetic cores; Magnetic materials; Magnetic separation; Polymers; Power electronics; Power filters; Soft magnetic materials; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE
Conference_Location
Palm Springs, CA
ISSN
1048-2334
Print_ISBN
978-1-4244-4782-4
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2010.5433665
Filename
5433665
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