DocumentCode :
1882832
Title :
High density low profile coupled inductor design for integrated Point-of-Load converter
Author :
Li, Qiang ; Dong, Yan ; Lee, Fred C.
Author_Institution :
Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear :
2010
fDate :
21-25 Feb. 2010
Firstpage :
79
Lastpage :
85
Abstract :
Low profile integrated Point-of-Load (POL) converter is today´s industry trend for portable electronic applications. Magnetics is the major challenge and bottleneck for achieving low profile high power density integrated POL. So, how to design a low profile magnetic becomes one of the key technologies for integrated POL. Inverse coupling is one of the possible methods to reduce inductor size due to the dc flux cancelling effect. Several integrated low profile coupled inductor structures with different flux patterns (vertical flux and lateral flux) are proposed in this paper based on low temperature co-fired ceramics (LTCC) technology. This paper also reveals that the lateral flux coupled inductor structure can have higher inductance density than vertical flux structure. Two LTCC coupled inductor prototypes are designed and fabricated to verify the theoretical analysis. A 1.5MHz, 5V to 1.2V, 3D integrated buck converter with LTCC coupled inductor substrate is also fabricated. The power density of this integrated converter is as high as 700W/in3.
Keywords :
ceramics; inductors; power convertors; 3D integrated buck converter; LTCC technology; dc flux cancelling effect; frequency 1.5 MHz; high density coupled inductor; integrated point-of-load converter; inverse coupling; lateral flux; low profile coupled inductor; low temperature co-fired ceramics; portable electronic applications; power density; vertical flux; Buck converters; Coils; Coupling circuits; Electronics industry; Inductance; Inductors; Magnetic cores; Magnetic flux; Power electronics; Prototypes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2010 Twenty-Fifth Annual IEEE
Conference_Location :
Palm Springs, CA
ISSN :
1048-2334
Print_ISBN :
978-1-4244-4782-4
Electronic_ISBN :
1048-2334
Type :
conf
DOI :
10.1109/APEC.2010.5433689
Filename :
5433689
Link To Document :
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