• DocumentCode
    1883059
  • Title

    An improved 3D integrated DC/DC converter for high temperature environments

  • Author

    Gerber, M. ; Ferreira, J.A. ; Hofsajer, I.W. ; Seliger, N.

  • Author_Institution
    Fac. of EWI, Delft Univ. of Technol., Netherlands
  • Volume
    4
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    2779
  • Abstract
    The automotive environment while being electrically and thermally harsh places many demands on the power electronics being utilized within it. For power converters, these demands are a high power density while operating in a high temperature environment. This paper presents a 2 kW DC/DC converter using a novel thermal management structure capable of operating with coolant temperatures up to 110 °C. The design of the converter topology is considered and the component losses are minimized with the aid of interleaving. With the reduced component losses and the novel thermal management structure, the passive components can be miniaturized while still meeting the required electrical and thermal specifications, thereby improving the power density. To validate the design of the converter, electromagnetic and thermal simulations are used. Finally, the converter is built and experimentally validated. The measured results are presented validating the design.
  • Keywords
    DC-DC power convertors; automotive electronics; thermal management (packaging); 2 kW; 3D integrated DC/DC converter; automotive environment; component losses; converter topology; coolant temperature; electrical specification; electromagnetic simulation; power converter; power density; power electronic; thermal management structure; thermal simulation; thermal specification; Automotive engineering; Coolants; DC-DC power converters; Energy management; Interleaved codes; Power electronics; Temperature; Thermal management; Thermal management of electronics; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
  • ISSN
    0275-9306
  • Print_ISBN
    0-7803-8399-0
  • Type

    conf

  • DOI
    10.1109/PESC.2004.1355273
  • Filename
    1355273