Abstract :
Integral substrates (printed wiring boards with buried capacitors and/or resistors) can lower costs, improve component density, improve performance and reliability. Integral substrates are economically and technically viable for replacing a large portion of the ceramic chip capacitors used for decoupling and resistor chips and networks used for termination, pull-up and pull-down. However, passive integration is easier said than done. Integral substrates require new design and test systems, manufacturing processes and materials. Further investigation concludes that stable, low cost materials and processes, design and test systems are only half the equation. In order for this technology to reach its full market potential, time-to-market issues such as rapid prototyping and engineering changes must be solved
Keywords :
assembling; capacitors; costing; hybrid integrated circuits; packaging; printed circuit manufacture; product development; resistors; substrates; buried capacitors; buried resistors; competition; cost savings; economic viability; engineering changes; glue components; integral passives; integral substrates; passive integration; printed wiring boards; product development cycle; rapid prototyping; stable low cost materials; technical viability; time-to-market issues; Capacitors; Ceramics; Costs; Integral equations; Manufacturing processes; Materials testing; Process design; Resistors; System testing; Wiring;
