Title :
Tapes and thick films for high frequency packaging
Author :
Wahlers, Richard L. ; Stein, Sidney J. ; Sykora, Glenn P.
Author_Institution :
Electro-Sci. Lab. Inc., King of Prussia, PA, USA
Abstract :
Low-K dielectrics in both thick-film and tape formats have been developed for meeting advanced packaging requirements. Compositions were formulated which fired to dense films at 850°C and provided a thermal coefficient of expansion (TCE) match to 96% Al2O3. Dielectric constants ranged from 4.0 to 5.0, depending on the termination and firing conditions. These dense low-dielectric-constant materials were characterized with respect to temperature dependence of K, dissipation factor, insulation resistance, and breakdown voltage. Moisture resistance, as determined by pressure-cooker testing, was also measured. Frequency effects in the range of 1 kHz to 1 MHz were determined with some measurements taken at frequencies as high as 9.3 GHz. Partial densification, binder decomposition, and controlled gas generation techniques were investigated as a means to introduce porosity and thereby lower K values. The most successful technique, controlled gas generation, produced pore porosity and K values as low as 2.5
Keywords :
ceramics; dielectric properties of solids; electric breakdown of solids; packaging; permittivity; thermal expansion; thick films; 1 kHz to 1 MHz; 850 degC; 9.3 GHz; advanced packaging; binder decomposition; breakdown voltage; controlled gas generation techniques; dense low-dielectric-constant materials; dissipation factor; frequency effects; glass-ceramics; high frequency packaging; insulation resistance; moisture resistance; partial densification; pastes; porosity; pressure-cooker testing; tape formats; temperature dependence; thermal expansion match; thick films; Dielectric constant; Dielectric materials; Dielectrics and electrical insulation; Electrical resistance measurement; Firing; Frequency; Packaging; Temperature dependence; Thermal expansion; Thick films;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122177