Low temperature co-fired glass-ceramic, high-density-interconnect, substrate with improved thermal management

A hybrid integrated regulator/modulator with a digital and analog signal bus system for power conditioning of a transmit/receive module having a density figure of merit of 69 W/in³ and 845 W/lb is described. High-density multichip power conditioning modules were designed using the Green Tape system, a low-temperature glass-ceramic substrate technology, as the base substrate. The design was fabricated, tested, and delivered for an advanced military application. The authors discuss aspects of this power conditioning circuit, including high-density computer-aided design and packaging concepts, the regulator/modulator system of power conditioning, design guidelines and substrate build characteristics of the glass-ceramic material system, thermal management solutions for high-powered chips, and reliability and performance data on the finished substrate and module