Title :
Advanced microelectronic packaging using BeO ceramics
Author :
Sepulveda, Juan L.
Author_Institution :
Brush Wellman Inc., Tucson, AZ, USA
Abstract :
Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of circuits to insure high performance operation and product reliability
Keywords :
beryllium compounds; ceramics; integrated circuit packaging; BeO; beryllia ceramic; microelectronic packaging; Ceramics; Copper; Electronic packaging thermal management; Electronics packaging; Gold; Metallization; Microelectronics; Substrates; Thermal conductivity; Thermal resistance;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664472
