DocumentCode :
1883733
Title :
Reducing data collection latency in Wireless sensor networks with mobile elements
Author :
He, Liang ; Pan, Jianping ; Xu, Jingdong
Author_Institution :
Univ. of Victoria, Victoria, BC, Canada
fYear :
2011
fDate :
10-15 April 2011
Firstpage :
572
Lastpage :
577
Abstract :
The introduction of mobile elements has created a new dimension to reduce and balance energy consumption in wireless sensor networks, however, data collection latency may become higher. Thus the scheduling of mobile elements, i.e., how they traverse through the sensing field and when they collect data from which sensor, is of ultimate importance and has attracted increasing attention from the research community. Formulated as the Traveling Salesman Problem with Neighborhoods (TSPN) and due to its NP-hardness, so far only approximation and heuristic algorithms have appeared in the literature, but the former only have theoretical value now due to their large approximation factors. In this paper, following a progressive optimization approach, we propose a combine-skip-substitute (css) scheme, which is shown to outperform the best known heuristic algorithm. Besides the correctness and complexity analysis of the proposed scheme, we also show its performance and potentials for further extension through extensive simulation results.
Keywords :
mobile communication; travelling salesman problems; wireless sensor networks; NP hardness; combine skip substitute scheme; complexity analysis; correctness analysis; data collection latency; energy consumption; heuristic algorithm; mobile elements; progressive optimization; research community; traveling salesman problem with neighborhoods; wireless sensor networks; Approximation algorithms; Approximation methods; Cascading style sheets; Mobile communication; Mobile computing; Robot sensing systems; Wireless sensor networks; TSPN; Wireless sensor networks; mobile elements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Communications Workshops (INFOCOM WKSHPS), 2011 IEEE Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4577-0249-5
Electronic_ISBN :
978-1-4577-0248-8
Type :
conf
DOI :
10.1109/INFCOMW.2011.5928878
Filename :
5928878
Link To Document :
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