DocumentCode :
1883804
Title :
Computation of transients in lossy VLSI packaging interconnections
Author :
Liao, J.C. ; Palusinski, O.A. ; Prince, J.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear :
1990
fDate :
20-23 May 1990
Firstpage :
173
Abstract :
An efficient method for analyzing the dynamic behavior of lossy electrical interconnects (with frequency-dependent parameters) in VLSI Systems is presented. The method allows for inclusion of the electrical interconnects which are terminated by networks of lumped passive (R , L, C) and active nonlinear devices (diodes, and bipolar and MOS transistors). The method consists of deriving the circuit model for a transmission line from impulse-response data and incorporating this model into the UANTL (University of Arizona simulator for nonlinearly terminated transmission-line networks) computer program, which performs time-domain analysis for coupled transmission lines with nonlinear terminations. Several numerical experiments with this method were performed. Comparisons were made between the results obtained using this method and other published results
Keywords :
VLSI; circuit analysis computing; coupled circuits; metallisation; transients; transmission line theory; UANTL computer program; University of Arizona simulator; VLSI Systems; active nonlinear devices; circuit model; coupled transmission lines; dynamic behavior analysis method; electrical interconnects; frequency-dependent parameters; impulse-response data; lossy VLSI packaging interconnections; lossy electrical interconnects; lumped passive devices; modeling; nonlinear terminations; nonlinearly terminated transmission-line networks; numerical experiments; on-chip transmission lines; time-domain analysis; transient waveforms; transients computation; transmission line; Analytical models; Computational modeling; Diodes; Distributed parameter circuits; Frequency; Integrated circuit interconnections; MOSFETs; Packaging; Power system transients; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ECTC.1990.122185
Filename :
122185
Link To Document :
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