DocumentCode :
1883824
Title :
Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design
Author :
You, Hong ; Soma, Mani
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fYear :
1990
fDate :
20-23 May 1990
Firstpage :
180
Abstract :
The authors present a novel approach to the crosstalk analysis of high-speed interconnects which are modeled as multiconductor transmission lines. The method is applicable to the general problem of N coupled lossy and/or dispersive interconnects with arbitrary linear source/load impedances. Closed-form formulas for determining the voltage and current transfer functions are derived using the spectral domain modal analysis technique. The transfer function is expanded to its Taylor series form, and the inverse Fourier transform is applied to the significant terms in the series. As a result, analytical expressions of time-domain signal waveforms are obtained. Besides providing valuable insight into the coupling phenomenon, the formulas facilitate analytical computation of noise and waveform distortion due to crosstalk
Keywords :
circuit analysis computing; coupled circuits; digital simulation; large scale integration; metallisation; transmission line theory; Taylor series; analytical computation of noise; analytical expressions; arbitrary linear impedances; coupled lossy interconnects; coupling phenomenon; crosstalk analysis; current transfer functions; dispersive interconnects; high-speed interconnect design; high-speed interconnects; inverse Fourier transform; load impedances waveform distortion computation; multiconductor transmission lines; package design; source impedances; spectral domain modal analysis technique; time-domain signal waveforms; voltage transfer functions; Analytical models; Couplings; Crosstalk; Dispersion; Impedance; Modal analysis; Multiconductor transmission lines; Taylor series; Transfer functions; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ECTC.1990.122186
Filename :
122186
Link To Document :
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