Title :
Trends in laser packaging
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
Abstract :
The author reviews the advances in the electrical, mechanical, and optical design of laser packages over the past few years and indicates the current state of the art. The examples focus on how changes in the design and materials have resulted in performance improvements and cost reductions. A list of desirable future laser packages is presented
Keywords :
microassembling; optical communication equipment; packaging; reviews; semiconductor junction lasers; technological forecasting; cost reductions; design changes; desirable features list; electrical design; laser chip packaging; laser packages; laser packaging; materials changes; mechanical design; optical design; performance improvements; state of the art; trends; Assembly; Costs; Fiber lasers; Laser theory; Optical design; Optical fiber cables; Optical fiber devices; Optical fiber testing; Optical sensors; Packaging machines;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122187
