• DocumentCode
    1883899
  • Title

    A stable laser module with UV-curable resin for single-mode subscriber use

  • Author

    Suzuki, M. ; Nakanishi, T. ; Tsuzuki, N. ; Murata, N.

  • Author_Institution
    NTT Opto-electron Lab., Kanagawa, Japan
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    200
  • Abstract
    The successful development of a low-cost laser-to-fiber coupling module for single-mode subscriber use is reported. The module consists of a laser collimator and a fiber collimator with a microball lens in each collimator, that is, a two-microball-lens system in a confocal condition. The key technology of this module is the high-precision bonding of a microball lens in front of a laser diode using a recently developed ultraviolet (UV)-curable resin. An average coupling efficiency of -4.7 dB with a standard deviation as small as 0.37 dB is achieved. It is found that the resin has good bonding durability and the module is stable under a temperature cycle test of over 1400 cycles. Simple structure and high reproducibility of the module have reduced the cost. A monolithically integrated laser diode and photodiode (LD-PD) are also developed. An output efficiency as high as 0.03 W/A is achieved in a 10-60°C temperature range by combining the LD-PD with the module
  • Keywords
    fibre optics; microassembling; optical communication equipment; optical couplers; packaging; semiconductor junction lasers; -4.7 dB; 10 to 60 C; LD-PD chip; UV-curable resin; bonding durability; confocal condition; coupling efficiency; fiber collimator; high reproducibility; high-precision bonding; laser collimator; laser diode; laser diode photodiode chip; laser monitoring photodiode; laser-to-fiber coupling module; low-cost; microball lens; monolithically integrated laser diode; output efficiency; packaging; single-mode subscriber use; stable laser module; temperature cycle test; temperature range; two-microball-lens system; Bonding; Collimators; Diode lasers; Fiber lasers; Laser stability; Lenses; Optical coupling; Resins; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122189
  • Filename
    122189