• DocumentCode
    188419
  • Title

    A drive cycle based electro-thermal analysis of traction inverters

  • Author

    Haizhong Ye ; Kai Yang ; Hao Ge ; Magne, Pierre ; Emadi, Ali

  • Author_Institution
    McMaster Inst. for Automotive Res. & Technol. (MacAUTO), McMaster Univ., Hamilton, ON, Canada
  • fYear
    2014
  • fDate
    15-18 June 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper presents an electro-thermal simulation model to estimate the power devices junction temperatures of traction inverter. The model includes four sub-systems: hybrid electric vehicle simulation, model of traction motor, temperature dependent power loss model, and the thermal model of traction inverter. Firstly, load profile of the traction inverter is obtained considering the vehicle dynamic, the traction motor, and the drive cycle of the vehicle. Then, instantaneous power loss is calculated by using the load profile of the inverter. Based on the power loss and developed thermal models, junction temperatures of power devices are estimated. With the feedback of the junction temperatures into the power loss model, the temperature dependent power losses are obtained. Therefore, the electro-thermal simulation of traction inverter can be conducted. The electro-thermal model presented in this paper is simulated for the Urban Dynamometer Driving Schedule (UDDS) drive cycle, and the junction temperatures of power devices are obtained.
  • Keywords
    hybrid electric vehicles; invertors; traction motor drives; UDDS drive cycle; developed thermal model; drive cycle-based electro-thermal analysis; electrothermal simulation model; hybrid electric vehicle simulation; instantaneous power loss; inverter load profile; power device junction temperature; power loss; temperature-dependent power loss model; traction inverter load profile; traction motor; traction motor model; urban dynamometer driving schedule; vehicle drive cycle; vehicle dynamic; Insulated gate bipolar transistors; Inverters; Junctions; Load modeling; Multichip modules; Temperature dependence; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Conference and Expo (ITEC), 2014 IEEE
  • Conference_Location
    Dearborn, MI
  • Type

    conf

  • DOI
    10.1109/ITEC.2014.6861761
  • Filename
    6861761