Study on heat sink performance with a thermo-siphon structure for LSI packages

Design features and experimental results are presented for a heatsink with the thermo-siphon structure for cooling multi- chip modules. The prototype heatsink was made, which consists of copper tubes, stainless container, PF-5060 as a coolant and rubber heaters for simulating multi-chip modules, and some basic experiments were carried out to obtain the cooling performance of the heatsink with the thermo-siphon structure. In this study, it was found that the thermal resistance values of 0.4-0.5 C/W at the heat dissipation range of 9.4 - 43.0 watts, under the condition of uniform air velocity of 2.6 m/s, were obtained.