Title :
300 mm fab design-a total factory perspective
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
This paper identifies 300 mm issues that affect the design of the factory from the individual machine to the overall concept, and assess which factors have the greatest potential impact on the physical factory. The discrimination between the facility and the manufacturing equipment blurs: the melding of the equipment and the facility progresses to the point wherein the design of the facility is synergetic with the equipment and the wafer handling scheme. This suggests a scenario wherein the entire physical factory is considered as an integral part of the manufacturing “machine”. This paper details many of the potential issues and outlines the elements of an advanced production factory
Keywords :
clean rooms; factory automation; integrated circuit manufacture; materials handling; production control; 300 mm; advanced production factory; cleanroom design; manufacturing equipment; manufacturing facility; semiconductor wafer fab design; tool layout design; total factory perspective; wafer handling scheme; Cleaning; Computer integrated manufacturing; Costs; Ergonomics; Instruments; Logistics; Manufacturing automation; Materials handling; Production facilities; Testing;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664481