• DocumentCode
    1884839
  • Title

    Computational method for system-level analysis of two-phase pumped loops for cooling of electronics

  • Author

    Kelkar, Kanchan M. ; Patankar, Suhas V. ; Kang, Sukhvinder S.

  • Author_Institution
    Innovative Res., Inc., Plymouth, MN
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    95
  • Lastpage
    104
  • Abstract
    Two-phase pumped-loop systems are being actively explored for the cooling of high-heat-flux electronics cooling because of their compactness and low thermal resistance. A typical two-phase pumped loop consists of a microchannel heat sink based evaporator, a finned-tube condenser, a reservoir, and a positive displacement pump. In the present study, the physics of operation of a two-phase pumped-loop system is presented. A two-level computational method, involving coupled component-level and system-level analyses, is then presented for predicting the performance of this system. Component models for the finned-tube condenser and the microchannel-heat-sink evaporator incorporate analysis of one-dimensional two-phase flow within the flow passages combined with correlations for friction factor and heat transfer coefficient under two-phase conditions. Further, the component model for the microchannel-heat-sink evaporator considers the interaction between conduction in the solid region and two-phase flow in individual channels. The system-level solution exploits the simplicity of the two-phase loop to analyze system-level interactions among the components. The computational method has been applied for the analysis of the performance of a practical two-phase pumped loop. Results of analysis illustrate the utility of the computational model in the design of two-phase pumped-loop systems.
  • Keywords
    cooling; microchannel flow; thermal management (packaging); two-phase flow; 1D two-phase flow; finned-tube condenser; high-heat-flux electronics cooling; microchannel heat sink evaporator; microchannel-heat-sink evaporator; positive displacement pump; reservoir; system-level analysis; thermal resistance; two-phase pumped loop; two-phase pumped-loop system; Electronics cooling; Friction; Heat pumps; Heat sinks; Heat transfer; Microchannel; Performance analysis; Physics; Reservoirs; Thermal resistance; Computational Analysis; Pumped Loop; Two-Phase Flow;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544259
  • Filename
    4544259